Wafer Biscuit Production Line

 Smashing Machine

    In the wafer line there is wastage from the cutting process which needs to be reused in order to minimize the overall wastage of wafer baking system which is about 2%. This equipment is used to grind the discarded wafer in to reusable form. The material is either used with the batter or cream depending on the requirement. The smashing or grinding machine is constructed out of stainless steel material to maintain hygiene of reusable product. The grinding system is driven by 3Kw motor to have high power and efficiency.

Dimension: 670x660x1150

Power: 3Kw